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We Accept PO's from Fortune 1000 Companies, Government Agencies (Federal, State, Local), Defense (Military, Air Force, Navy), Universities, Schools and Colleges.
3D-12D214N64S643-256M 256MB Module DDR2 SoDimm 200-Pin PC2-5300 CL=5 non-ECC Unbuffered DDR2-667 1.8V 32Meg x 64 for Toshiba Satellite Pro A200-EZ2204X KTT667D2/256
Mfg Part No:
Global Part Number (GPN):
3D-12D214N64S643-256M
Global Part Number (GPN):
1438439557
Looking for a large quantity of 3D-12D214N64S643-256M? Call us at (800) 821-3354 or Request a Quote below and one of our sales representative will get in touch with you very soon.
Technical Specifications for 3D-12D214N64S643-256M
| Manufacturer | 3D Memory |
| Manufacturer Part # | 3D-12D214N64S643-256M |
| Memory Type | SODIMM |
| Capacity | 256MB |
| Data Transfer Rate | 667Mhz |
| Pins | 200 Pin |
| Bus Type | PC-5300 |
| Error Correction | Non-ECC |
| Cycle Time | 6ns |
| Cas | CL5 |
| Memory Clock | 166Mhz |
| Rank | Rank 1 |
| Voltage | 1.8 |
Request for Quote: 3D-12D214N64S643-256M
Please call at (800) 821-3354 and one of our representative will be happy to assist you with part no 3D-12D214N64S643-256M. Or Request a Quote below:
General Information
Please note SODIMM comes in high density and low density types. In some old system high density parts might not work. A 4 GB built with 512x8 (8 chips) is a high density and built with 256x8(16 chip) is a low density module. A 2 GB built with 256x8 (8 chips) is a high density and built with 128x8 (16 chips) is a low density module. Similarly 1 GB built with 128x8(8 chips) is a high density and built with 64x8 (16 chips) is a low density module.
Please call us for any further assistance.3D-12D214N64S643-256M 256MB Module DDR2 SoDimm 200-Pin PC2-5300 CL=5 non-ECC Unbuffered DDR2-667 1.8V 32Meg x 64 for Toshiba Satellite Pro A200-EZ2204X KTT667D2/256 Refurbished
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